The new Apple Watch may have a new, thinner motherboard! It may not make the device thinner. But other ingredients can be added.
Rumor! Apple Watch Series 10 may use a new, thinner motherboard
Rumors have emerged from suppliers claiming that Apple may switch to a new, thinner motherboard made from resin-coated copper for the Apple Watch. It is expected to be implemented in the new Apple Watch, in line with previous rumors linking it to the iPhone 17.
Resin-Coated Copper (RCC) As the name suggests, it is a resin-coated copper sheet. Its distinctive feature is its lightness and makes the manufacturing process easier. In October 2023, Ming-Chi Kuo stated that Apple would use this technology in the iPhone because it has the advantage of being thin and light.
Recently, an unnamed inside source from Digitimes reported that this RCC technology will be used in at least one Apple Watch model. It’s unclear whether this will be a 2024 model or not, but there have been rumors previously about a major redesign of the “Apple Watch Series X”.
Digitimes cites rumors that Apple is reuniting with Nan Ya PCB for the new Apple Watch. The company has previously worked with Apple on space-saving designs for the Apple Watch’s interior.
Switching to a thinner RCC motherboard may not mean the Apple Watch body will be thinner, but it may mean more internal space. Allows you to fit more components inside.
This news is in line with rumors that Apple is trying to include a blood pressure sensor in the Apple Watch and therefore needs a larger battery capacity.
Ming-Chi Kuo says RCC will be ready in the third quarter of 2024, which is unlikely for a September-October 2024 release. Fixing the fragility issue of RCC motherboards will take a long time. It is expected to be used in the iPhone 17 of 2025.
Source – appleinsider
